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 MJD45H11
MJD45H11
General Purpose Power and Switching Such as Output or Driver Stages in Applications D-PAK for Surface Mount Applications
* * * * * Load Formed for Surface Mount Application (No Suffix) Straight Lead (I-PAK: "-I" Suffix) Electrically Similar to Popular MJE45H Fast Switching Speeds Low Collector Emitter Saturation Voltage
1
D-PAK 1.Base
1
I-PAK 3.Emitter
2.Collector
PNP Epitaxial Silicon Transistor
Absolute Maximum Ratings TC=25C unless otherwise noted
Symbol VCEO VEBO IC ICP PC TJ TSTG Parameter Collector-Emitter Voltage Emitter-Base Voltage Collector Current (DC) Collector Current (Pulse) Collector Dissipation (TC=25C) Collector Dissipation (Ta=25C) Junction Temperature Storage Temperature Value - 80 -5 -8 - 16 20 1.75 150 - 55 ~ 150 Units V V A A W W C C
Electrical Characteristics TC=25C unless otherwise noted
Symbol VCEO(sus) ICEO IEBO hFE VCE(sat) VBE(on) fT Cob tON tSTG tF Parameter *Collector-Emitter Sustaining Voltage Collector Cut-off Current Emitter Cut-off Current *DC Current Gain *Collector-Emitter Saturation Voltage *Base-Emitter Saturation Voltage Current Gain Bandwidth Product Collector Capacitance Turn On Time Storage Time Fall Time Test Condition IC = - 30mA, IB = 0 VCE = - 80V, IB = 0 VBE = - 5V, IC = 0 VCE = - 1V, IC = - 2A VCE = - 1V, IC = - 4A IC = - 8A, IB = - 0.4A IC = - 8A, IB = - 0.8A VCE= - 10A, IC = - 0.5A VCB = - 10V, f = 1MHz IC = - 5A IB1= - IB2 = - 0.5A 40 230 135 500 100 60 40 -1 - 1.5 V V MHz pF ns ns ns Min. - 80 Typ. Max. - 10 - 50 Units V A A
* Pulse Test: PW300s, Duty Cycle2%
(c)2003 Fairchild Semiconductor Corporation
Rev. C2, July 2003
MJD45H11
Typical Characteristics
1000
-100
VCE = -1V
IC[A], COLLECTOR CURRENT
ICP (max)
-10
10
hFE, DC CURRENT GAIN
100
IC(max)
DC
50
0
1m 5m s
0
s
s
s
-1
10
-0.1
1 -0.01
-0.01 -0.1 -1 -10 -1 -10 -100 -1000
IC[A], COLLECTOR CURRENT
VCE[V], COLLECTOR-EMITTER VOLTAGE
Figure 1. DC current Gain
Figure 2. Safe Operating Area
25
PC[W], POWER DISSIPATION
20
15
10
5
0 0 25 50
o
75
100
125
150
175
TC[ C], CASE TEMPERATURE
Figure 3. Power Derating
(c)2003 Fairchild Semiconductor Corporation
Rev. C2, July 2003
MJD45H11
Package Dimensions
D-PAK
6.60 0.20 5.34 0.30 (0.50) (4.34) (0.50)
0.70 0.20
2.30 0.10 0.50 0.10
0.60 0.20
6.10 0.20
2.70 0.20
9.50 0.30
0.91 0.10
0.80 0.20
MAX0.96 2.30TYP [2.300.20]
0.76 0.10 2.30TYP [2.300.20]
0.89 0.10
0.50 0.10 1.02 0.20 2.30 0.20
(0.70)
(0.90) (0.10) (3.05)
6.10 0.20
9.50 0.30
2.70 0.20
(2XR0.25)
0.76 0.10
Dimensions in Millimeters
(c)2003 Fairchild Semiconductor Corporation Rev. C2, July 2003
(1.00)
6.60 0.20 (5.34) (5.04) (1.50)
MIN0.55
MJD45H11
Package Dimensions
(Continued)
I-PAK
6.60 0.20 5.34 0.20 (0.50) (4.34) (0.50) 0.50 0.10 2.30 0.20
0.20
0.20
0.60
0.70
0.10
6.10
0.20
0.80
0.20
1.80
MAX0.96 0.76 0.10
9.30
0.30
2.30TYP [2.300.20]
2.30TYP [2.300.20]
0.50 0.10
(c)2003 Fairchild Semiconductor Corporation
16.10
0.30
Dimensions in Millimeters
Rev. C2, July 2003
TRADEMARKS
The following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.
ACExTM FACTTM ActiveArrayTM FACT Quiet SeriesTM BottomlessTM FAST(R) FASTrTM CoolFETTM CROSSVOLTTM FRFETTM GlobalOptoisolatorTM DOMETM EcoSPARKTM GTOTM E2CMOSTM HiSeCTM EnSignaTM I2CTM Across the board. Around the world.TM The Power FranchiseTM Programmable Active DroopTM DISCLAIMER
ImpliedDisconnectTM ISOPLANARTM LittleFETTM MicroFETTM MicroPakTM MICROWIRETM MSXTM MSXProTM OCXTM OCXProTM OPTOLOGIC(R) OPTOPLANARTM
PACMANTM POPTM Power247TM PowerTrench(R) QFET(R) QSTM QT OptoelectronicsTM Quiet SeriesTM RapidConfigureTM RapidConnectTM SILENT SWITCHER(R) SMART STARTTM
SPMTM StealthTM SuperSOTTM-3 SuperSOTTM-6 SuperSOTTM-8 SyncFETTM TinyLogic(R) TruTranslationTM UHCTM UltraFET(R) VCXTM
FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.
LIFE SUPPORT POLICY
FAIRCHILD'S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
PRODUCT STATUS DEFINITIONS Definition of Terms
Datasheet Identification Advance Information Product Status Formative or In Design First Production Definition This datasheet contains the design specifications for product development. Specifications may change in any manner without notice. This datasheet contains preliminary data, and supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design. This datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor. The datasheet is printed for reference information only.
Preliminary
No Identification Needed
Full Production
Obsolete
Not In Production
(c)2003 Fairchild Semiconductor Corporation
Rev. I3


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